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Title
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Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics
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Sub-Title |
effect of pin-fin diameter
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Subject |
Round pin-fin, Heat Sink, Phase change material, Thermal conductivity enhancers, Paraffin wax, Set point temperatures, Enhancement ratio, Heat capacity, Thermal conductance
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Sub-Subject |
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Author |
Adeel Arshad, Hafiz Muhammad Ali, Shahab Khushnood
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Publish Year |
2018 |
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Supervisor |
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Diss#. |
https://doi.org/10.1016/j.ijheatmasstransfer.2017. |
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Pages |
861-872 |
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Text Language |
English |
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Accession |
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Library Section |
Research Article |
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Abstract |
This experimental study presents the parametric analysis for the round pin-finned heat sinks subjected to steady heat densities for effective and reliable cooling of mobile electronic devices. Phase change material (PCM) namely paraffin wax is adopted as energy storage material and aluminum made round pin-fins are selected as thermal conductivity enhancers (TCEs). A constant volume fraction of 9% of round pin-fins is selected with pin diameter of 2 mm; 3 mm and 4 mm and input heat flux was provided from 1:6 kW=m2 to 3:2 kW=m2 with an increment of 0:4 kW=m2. Three volume fractions of w ¼ 0:0; w ¼ 0:5 and w ¼ 1:0 of PCM amount are poured in each configuration of pin-finned heat sinks. A heat sink with no fin is chosen as a reference heat sink to quantify the effect of PCM and TCEs. The thermal performance of PCM filled heat sinks are analyzed to explore the effect of volumetric fractions of PCM, heat densities, pin diameter on latent heat phase, enhancement in operation time, heat capaci
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